| |
Technology Capabilities
Revolutionizing
the Manufacture of PICs with QWI
1.
QWI enables Higher Yields and Lower Costs
DenseLight developed its one-step implantation technique which simplifies
the PIC fabrication process tremendously, greatly improving the prospect of
high yield and low cost PIC products. DenseLight's manufacturing center in
Singapore has realized this fabrication technology and aims to supply
customers with its range of advanced PICs products.

Monolithically integrated 40-channel AWG filter with a 40-photodiode array
on indium phosphide substrate
measuring only 6 mm by 8 mm. This was fabricated using ion implantation QWI
process.
2.
QWI enables 2D freedom in Bandgap Engineering
Because bandgaps can be fine tuned at any selected regions of the QW
structure, the QWI technique gives complete 2 dimensional freedom in bandgap
engineering. This opens up tremendous design possibilities in photonic
integrated circuits. QWI fabrications may allow a photonic IC designer to
layout optical functions in a 2 dimensional manner much like an integrated
circuit designer in the electronic domain. Through this technique, it is
conceivable to manufacture different active and passive regions in various
geometric configurations on a single wafer creating densely function-packed
PICs!
By creating different bandgap energies in neighboring cells via QWI,
the different active regions are able to lase at different wavelengths,
creating a multiple wavelength laser array.
Quantum well intermixing was used to engineer the bandgap of the AWG filter
to be transparent,
while the broadband photodetector array converts light energy into
electrical energy.
Quantum well intermixing is able to monolithically integrate a DFB laser and
an electro absorption modulator by
adjusting the bandgap energies of the 2 regions on the wafer. The DFB
section has bandgap energy close to
photonic range, while the EA Modulator section has higher bandgap energy at
zero bias.
3.
QWI enables efficient PIC supply chains
DenseLight envisions the day when the the design of photonic integrated
circuits can be composed on a set of common photonic devices such as laser
sources, SOAs (semiconductor optical amplifiers), demultiplexing filters,
electro-absorption modulators, photodetectors, passive waveguides and
couplers. These devices are characterized and standardized as a set of
photonic device design libraries.
A photonic foundry firm should be able to take such a design and manufacture
it in mass volumes. This model ultimately points the way to an outsourced
photonic supply chain where it is feasible for firms to segregate design,
manufacture and distribution activities reducing the need for vertically
integrated firms. With such segregation, outsourcing is possible, yielding
benefits from economies of specialization in design firms and economies of
scale in foundry firms. Hence, better and cheaper photonic components will
eventually empower optical networks.
 |