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A PORTFOLIO OF
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We are ready to lead you into the future of light no matter where your business operates.
SOA Versatility:
Engineered for different wavelengths, gain profiles, integration levels, and operational modes:
C and L Band, Chip on Sub mount, BTF 14Pin.
Broad Wavelength Range - Different wavelength bands (O, C, L )
Multi-band Operation: Advanced SOAs can cover multiple bands supporting WDM and other multi-channel systems, > 100 nm
Customizable Gain Profiles: Gain Spectrum Engineering, width and flatness can be optimized for specific applications. High PDG/Low PDG
High Gain Options: (14 dB/17dB), amplify low signals efficiently.
Low Noise Figures: (ASE) noise for cleaner signal amplification < 7dB.
Hybrid Integration: SOAs coupled with silicon photonics. Low PDG version available.
Operational Modes: CW and Pulsed Operation. High Speed amplification switching with ER > 60dB
Specialized Functions - Optical Switching, Polarization Insensitivity
C and L Band, Chip on Sub mount, BTF 14Pin.
Broad Wavelength Range - Different wavelength bands (O, C, L )
Multi-band Operation: Advanced SOAs can cover multiple bands supporting WDM and other multi-channel systems, > 100 nm
Customizable Gain Profiles: Gain Spectrum Engineering, width and flatness can be optimized for specific applications. High PDG/Low PDG
High Gain Options: (14 dB/17dB), amplify low signals efficiently.
Low Noise Figures: (ASE) noise for cleaner signal amplification < 7dB.
Hybrid Integration: SOAs coupled with silicon photonics. Low PDG version available.
Operational Modes: CW and Pulsed Operation. High Speed amplification switching with ER > 60dB
Specialized Functions - Optical Switching, Polarization Insensitivity
Recommended Links
SOA – C Band
At the forefront of broadband high-gain technology, our DS-SA Series Semiconductor Optical Amplifiers (SOA) are meticulously engineered to meet the demands of customers searching for cutting-edge coherent light solutions.
Key Features:
•High Optical Gain ≥20dB
•High Saturation Output Power ≥20dBm:
•Broad Bandwidth Over C-Band:
•Package: Available in a 14-Pin BTF, Chip on Submount configuration
•TEC Cooled: Incorporates Thermal Electric Cooling (TEC)
Key Features:
•High Optical Gain ≥20dB
•High Saturation Output Power ≥20dBm:
•Broad Bandwidth Over C-Band:
•Package: Available in a 14-Pin BTF, Chip on Submount configuration
•TEC Cooled: Incorporates Thermal Electric Cooling (TEC)
Recommended Links
SOA – L Band
A Semiconductor Optical Amplifier (SOA) in the L-band (1565–1625 nm)
• Broad Wavelength Range: Covers different wavelength bands (e.g., O, E, S, C, and L bands) to support diverse applications.
• Multi-band Operation: Advanced SOAs can cover multiple bands simultaneously, supporting Wavelength Division Multiplexing (WDM) and other multi-channel systems with a wide wavelength range > 100 nm.
• Customizable Gain Profiles: Gain Spectrum Engineering allows optimization of width and flatness for specific applications, offering high and low PDG options.
• Broad Wavelength Range: Covers different wavelength bands (e.g., O, E, S, C, and L bands) to support diverse applications.
• Multi-band Operation: Advanced SOAs can cover multiple bands simultaneously, supporting Wavelength Division Multiplexing (WDM) and other multi-channel systems with a wide wavelength range > 100 nm.
• Customizable Gain Profiles: Gain Spectrum Engineering allows optimization of width and flatness for specific applications, offering high and low PDG options.
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SOA – Super C
A Semiconductor Optical Amplifier (SOA) in the Super C-band (approximately 1525–1570 nm) extends the conventional C-band range, enabling higher data capacity in fiber optic networks
Our DS-SA Series SOA represents the pinnacle of our commitment to delivering high-gain, broadband solutions for the most demanding coherent light applications. Trust in our expertise to elevate your optical communication systems to new heights.
Our DS-SA Series SOA represents the pinnacle of our commitment to delivering high-gain, broadband solutions for the most demanding coherent light applications. Trust in our expertise to elevate your optical communication systems to new heights.
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SOA – Super L
A Semiconductor Optical Amplifier (SOA) in the Super L-band (approximately 1570–1625 nm) extends the traditional L-band, increasing bandwidth for high-capacity fiber optic networks
•Multi-band Operation: Advanced SOAs can cover multiple bands simultaneously, supporting Wavelength
Division Multiplexing (WDM) and other multi-channel systems with a wide wavelength range > 100 nm.
•Multi-band Operation: Advanced SOAs can cover multiple bands simultaneously, supporting Wavelength
Division Multiplexing (WDM) and other multi-channel systems with a wide wavelength range > 100 nm.
Recommended Links
SOA - Independent Pol
• Hybrid Technology Platform: Designed for polarization-independent needs with a platform design of < 3dB PER.
• PER < 3 dB
• Optical Power/Bandwidth Dependent on SOA Chip
• Current Wavelengths in Development in our HOSA Packaged Format for C&L Band
• PER < 3 dB
• Optical Power/Bandwidth Dependent on SOA Chip
• Current Wavelengths in Development in our HOSA Packaged Format for C&L Band
Recommended Links
SOA - Dependent Pol
• High Gain Options: SOAs can deliver high gain (15 dB/20dB) to efficiently amplify low signals.
• Low Noise Figures: Achieves cleaner signal amplification with ASE noise figures < 7dB.
• Hybrid Integration: SOAs can be coupled with silicon photonics or other platforms for enhanced system capabilities, with low PDG versions available.
• Operational Modes: Supports Continuous Wave (CW) and Pulsed Operation, with high-speed amplification switching and ER > 60dB.
• Specialized Functions: Includes optical switching and polarization insensitivity to meet advanced system requirements.
• Low Noise Figures: Achieves cleaner signal amplification with ASE noise figures < 7dB.
• Hybrid Integration: SOAs can be coupled with silicon photonics or other platforms for enhanced system capabilities, with low PDG versions available.
• Operational Modes: Supports Continuous Wave (CW) and Pulsed Operation, with high-speed amplification switching and ER > 60dB.
• Specialized Functions: Includes optical switching and polarization insensitivity to meet advanced system requirements.
Recommended Links
SOA - Switch
A Semiconductor Optical Amplifier (SOA) switch is an optical device that utilizes the amplification characteristics of an SOA to control the flow of optical signals. By adjusting the input signal’s power or polarization, the SOA switch can toggle between different paths in a fiber optic network. It offers fast switching speeds, low power consumption, and compact integration, making it ideal for optical signal routing and switching in modern photonic and telecommunications systems.
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SOA - P-side Up
In hybrid photonic assembly, P-side up is the preferred orientation because it enables:Easy optical alignment
• Accessible electrical contacts
• Efficient thermal conduction
• Compatibility with wire bonding
• Simplified mechanical integration when working with discrete active components integrated into a larger optical engine
• P-side up provides the best balance of performance, manufacturability, and alignment precision.
• Accessible electrical contacts
• Efficient thermal conduction
• Compatibility with wire bonding
• Simplified mechanical integration when working with discrete active components integrated into a larger optical engine
• P-side up provides the best balance of performance, manufacturability, and alignment precision.
Recommended Links
SOA - P-side Down
P-side down enables flip-chip bonding, where the electrical contacts are brought face-down toward the substrate, Eliminates wire bonds — especially useful in high-frequency or dense assemblies.
• P-side down orientation is used when the design requires: Flip-chip assembly
• Minimal inductance for RFWafer-level integration
• Specific optical paths or coupling geometry
• It comes with more complex packaging, alignment, and thermal constraints,
• P-side down orientation is used when the design requires: Flip-chip assembly
• Minimal inductance for RFWafer-level integration
• Specific optical paths or coupling geometry
• It comes with more complex packaging, alignment, and thermal constraints,
Recommended Links
Generative “Gain Chips”
High Optical Gain for Photonic Devices Broadband Gain Enabling 120 Channels @ 50Ghz spacing in C&L Band.
Optical Gain: Provides high optical gain over a specific wavelength range, enabling high channel count.
Customizable Optical Coating: HR >92%, LR (4-25%), Anti Reflection (Air or Epoxy ambient)
Broad Wavelength Coverage: Wavelength ranges such as O, E, S, C, L, and U-bands.
Compact Design: Small form factors make them ideal for integration.
Low Noise and High Stability: Carefully designed to minimize amplified spontaneous emission (ASE) noise.
Flexible Integration: Compatible with external cavities, gratings, or reflectors.
High Power Output: Designed as a laser gain source, can deliver significant output power.
Optical Gain: Provides high optical gain over a specific wavelength range, enabling high channel count.
Customizable Optical Coating: HR >92%, LR (4-25%), Anti Reflection (Air or Epoxy ambient)
Broad Wavelength Coverage: Wavelength ranges such as O, E, S, C, L, and U-bands.
Compact Design: Small form factors make them ideal for integration.
Low Noise and High Stability: Carefully designed to minimize amplified spontaneous emission (ASE) noise.
Flexible Integration: Compatible with external cavities, gratings, or reflectors.
High Power Output: Designed as a laser gain source, can deliver significant output power.
Recommended Links
Gain Chip - C Band
The DS-GC Series Gain Chips
Generative “Gain Chips”: High Optical Gain for Photonic Devices. These gain chips are designed to provide high optical gain, essential for high-performance photonic devices
Key Features:
•Broad Tuning Range:
•High Output Power.
•Low Ripple:
•Dies/Chip on Submount:
•Optical Exit Angle 23°
Generative “Gain Chips”: High Optical Gain for Photonic Devices. These gain chips are designed to provide high optical gain, essential for high-performance photonic devices
Key Features:
•Broad Tuning Range:
•High Output Power.
•Low Ripple:
•Dies/Chip on Submount:
•Optical Exit Angle 23°
Recommended Links
Gain Chip - L Band
The DS-GC Series Gain Chips are pivotal in advancing coherent sensing and optical communication technologies. These high-performance gain chips are designed to provide exceptional optical gain, ensuring superior signal integrity and performance in a variety of applications.
•Customizable Optical Coating: HR >92%, LR (4-25%), Anti Reflection (Air or Epoxy ambient) for tailored performance.
•Broad Wavelength Coverage: Suitable for O, E, S, C, L, and U-bands, ensuring versatility in various applications.
•Customizable Optical Coating: HR >92%, LR (4-25%), Anti Reflection (Air or Epoxy ambient) for tailored performance.
•Broad Wavelength Coverage: Suitable for O, E, S, C, L, and U-bands, ensuring versatility in various applications.
Recommended Links
Gain Chip - 100nm BW
A chip with 100 nm bandwidth capability that can amplify light across a huge optical spectrum, ie: From 1500 nm to 1600 nm, or more broadly 1480–1580 nm (S/C/L band regions)
A 100 nm bandwidth gain chip is a strategic photonic component enabling broad, agile, and high-resolution optical systems. It's especially valuable in applications that demand
• Tunability
• High coherence
• Compact integration
• Wide spectral response
DLS Gain chips form the heart of next-gen photonic engines: LIDARs, OCTs, swept lasers, and multi-band optical sensors.
A 100 nm bandwidth gain chip is a strategic photonic component enabling broad, agile, and high-resolution optical systems. It's especially valuable in applications that demand
• Tunability
• High coherence
• Compact integration
• Wide spectral response
DLS Gain chips form the heart of next-gen photonic engines: LIDARs, OCTs, swept lasers, and multi-band optical sensors.
Recommended Links
Gain Chip > 70 mW
The significance of the DenseLight high-power gain chips (i.e., optical gain chips with output powers >70 mW, typically up to 100–200 mW)
• The ability to extend the performance, range, and utility of photonic system
• In applications that require strong optical signals, high signal-to-noise ratio (SNR), or long reach.
• The ability to extend the performance, range, and utility of photonic system
• In applications that require strong optical signals, high signal-to-noise ratio (SNR), or long reach.
Recommended Links
Gain Chip - Tunable
Denselight Gain Chips are used as a core building block in:
•Tunable lasers
•Swept-source systems
•Agile optical transceivers
•Broadband photonic signal processors
•Low Noise and High Stability: Minimizes amplified spontaneous emission (ASE) noise for stable operation, with angled front facet for BR suppression
•Flexible Integration: Compatible with external cavities, gratings, or reflectors for building tunable lasers or frequency-stabilized sources.
•High Power Output: Capable of delivering significant output power, making them suitable for high-performance systems.
•Tunable lasers
•Swept-source systems
•Agile optical transceivers
•Broadband photonic signal processors
•Low Noise and High Stability: Minimizes amplified spontaneous emission (ASE) noise for stable operation, with angled front facet for BR suppression
•Flexible Integration: Compatible with external cavities, gratings, or reflectors for building tunable lasers or frequency-stabilized sources.
•High Power Output: Capable of delivering significant output power, making them suitable for high-performance systems.
Recommended Links
Gain Chip - Narrow LW
Denselight gain chips supports and preserves narrow linewidth becomes a building block for high-performance optical engines. A gain chip that enables narrow linewidth is a strategic advantage for any photonics supplier because it:
Opens access to high-value, coherent applications
Enables customers to build best-in-class optical engines
Differentiates you in a crowded SOA/gain chip market
Justifies premium pricing and long-term supply agreements
It’s more than a spec — it’s an enabler of next-gen LIDAR, OCT, and precision photonics.
•Low Noise and High Stability:
•Flexible Integration:
•High Power Output:
Opens access to high-value, coherent applications
Enables customers to build best-in-class optical engines
Differentiates you in a crowded SOA/gain chip market
Justifies premium pricing and long-term supply agreements
It’s more than a spec — it’s an enabler of next-gen LIDAR, OCT, and precision photonics.
•Low Noise and High Stability:
•Flexible Integration:
•High Power Output:
Recommended Links
Gain Chip - P-side Up
Advanced Configuration Options:
•Chip metallization optimized for various mounting configurations, including flip-chip assembly onto SiPh chips.
•Form Factor of Bare Die and CoS: Expertise in bar/die handling and assembly to meet specific customer requirements
The P-side orientation of a gain chip directly impacts its Thermal handling, Modulation speed, Assembly method, and end-use suitability.
•Chip metallization optimized for various mounting configurations, including flip-chip assembly onto SiPh chips.
•Form Factor of Bare Die and CoS: Expertise in bar/die handling and assembly to meet specific customer requirements
The P-side orientation of a gain chip directly impacts its Thermal handling, Modulation speed, Assembly method, and end-use suitability.
Recommended Links
Gain Chip - P-side Down
Expertise in the Main Building Blocks of Gain Chip Technology:
P-side orientation (P-side up vs. P-side down) has implications in how a gain chip is designed, packaged, and used — especially when dealing with optical amplifiers or laser gain chips in hybrid photonic assemblies, swept-source lasers, or LIDAR engines.
P-side down for: High-power performance (>70 mW)Flip-chip integration High-speed or rugged packaging. P-down is preferred for high-speed modulation or when the gain chip is part of an integrated electro-optic circuit.
P-side orientation (P-side up vs. P-side down) has implications in how a gain chip is designed, packaged, and used — especially when dealing with optical amplifiers or laser gain chips in hybrid photonic assemblies, swept-source lasers, or LIDAR engines.
P-side down for: High-power performance (>70 mW)Flip-chip integration High-speed or rugged packaging. P-down is preferred for high-speed modulation or when the gain chip is part of an integrated electro-optic circuit.
Recommended Links
High-Power CW Lasers for CWDM
Our DS-DF3 Series 1310nm Distributed Feedback (DFB)
A High-Power Continuous-Wave (CW) Laser for Coarse Wavelength Division Multiplexing (CWDM) stable and high-intensity laser output over specific wavelength bands.
Delivers power levels from 70 mW to 100mW, @ 75 Deg C.
Broad Wavelength Range for CWDM: O Band – FR4, DR4, 1270 nm to 1610 nm in 20 nm channel spacing, aligned with the CWDM ITU grid.
Continuous-Wave Operation: Ensures stable, uninterrupted output, ideal for optical communication and sensing applications.
Wavelength Stability: Designed with integrated temperature and current stabilization to maintain precise wavelength over time.
Compact and Reliable Design: BH and RWG Options, Packaged for robustness and long-term operation in demanding environments
Modulation Capability: Supports external modulation for CWDM systems, enabling high-speed data transmission. 50G
Integrated Electronics: Options for built-in drivers, power control, and USB/GUI interfaces for user-friendly operation and precise control.
A High-Power Continuous-Wave (CW) Laser for Coarse Wavelength Division Multiplexing (CWDM) stable and high-intensity laser output over specific wavelength bands.
Delivers power levels from 70 mW to 100mW, @ 75 Deg C.
Broad Wavelength Range for CWDM: O Band – FR4, DR4, 1270 nm to 1610 nm in 20 nm channel spacing, aligned with the CWDM ITU grid.
Continuous-Wave Operation: Ensures stable, uninterrupted output, ideal for optical communication and sensing applications.
Wavelength Stability: Designed with integrated temperature and current stabilization to maintain precise wavelength over time.
Compact and Reliable Design: BH and RWG Options, Packaged for robustness and long-term operation in demanding environments
Modulation Capability: Supports external modulation for CWDM systems, enabling high-speed data transmission. 50G
Integrated Electronics: Options for built-in drivers, power control, and USB/GUI interfaces for user-friendly operation and precise control.
Recommended Links
DFB - O Band
DS-DF3 Series 1310nm Distributed Feedback (DFB) lasers
Telecom and Datacom applications. These lasers are ideally suited for Coarse Wavelength Division Multiplexing (CWDM) in both FR4 and DR4 formats.
Key Features and Capabilities:
•Excellent Linewidth < 1MHz:
•High Fiber Output Power up to 100mW/>100mW:
•Low Relative Intensity Noise
•Package: 14-Pin BTF package
•Stable Performance:.
•Integrated Isolator Option:.
•TEC Cooled: High Temp Available (85 Deg C)
Telecom and Datacom applications. These lasers are ideally suited for Coarse Wavelength Division Multiplexing (CWDM) in both FR4 and DR4 formats.
Key Features and Capabilities:
•Excellent Linewidth < 1MHz:
•High Fiber Output Power up to 100mW/>100mW:
•Low Relative Intensity Noise
•Package: 14-Pin BTF package
•Stable Performance:.
•Integrated Isolator Option:.
•TEC Cooled: High Temp Available (85 Deg C)
Recommended Links
DFB - C Band
Our C-Band Distributed Feedback (DFB) Lasers deliver exceptional performance, making them the ideal choice for demanding optical applications across diverse industries.
Key Features and Capabilities:
•Narrow Linewidth (<1 500 Khz)
•DWDM Wavelength Coverage, Available on the ITU grid
•High Fiber Output Power (Up to 100 mW)
•Low Relative Intensity Noise (RIN) > 150 dB/Hz
.
Key Features and Capabilities:
•Narrow Linewidth (<1 500 Khz)
•DWDM Wavelength Coverage, Available on the ITU grid
•High Fiber Output Power (Up to 100 mW)
•Low Relative Intensity Noise (RIN) > 150 dB/Hz
.
Recommended Links
DFB - ITU
•DWDM Wavelength Coverage
Available on the ITU grid, providing a wide selection of Dense Wavelength Division Multiplexing (DWDM) wavelengths to meet the requirements of optical transport networks and scalable system designs.
Available on the ITU grid, providing a wide selection of Dense Wavelength Division Multiplexing (DWDM) wavelengths to meet the requirements of optical transport networks and scalable system designs.
Recommended Links
DFB - CWDM
•1310 CWDFB High Power DFB Laser Source (100mW CW DFB Chip): The DS-DF31001D-TM is an InGaAsP-based and uncooled distributed feedback laser optimized for data comm application. Denselight’s advanced technology enables mode-hop-free tunability, high power, excellent SMSR, and high accuracy of lasing wavelength.
•1310nm CWDFB High Power DFB Laser Source (50mW/14-Pin Butterfly Package): The DS-DF30501A1-FP-1310-T45 is an InGaAsP-based and cooled distributed feedback laser optimized for free-space optical communications. Denselight’s advanced technology enables mode-hop-free tunability, high power, excellent SMSR, and high accuracy of lasing wavelength.
•1310nm CWDFB High Power DFB Laser Source (50mW/14-Pin Butterfly Package): The DS-DF30501A1-FP-1310-T45 is an InGaAsP-based and cooled distributed feedback laser optimized for free-space optical communications. Denselight’s advanced technology enables mode-hop-free tunability, high power, excellent SMSR, and high accuracy of lasing wavelength.
Recommended Links
DFB - Linewidth
Designed for Scalability and Integration:
Denselight offers versatility and reliability, our DFB Lasers provide the foundation for cutting-edge solutions into communications, sensing, and photonic integration
•Excellent Linewidth < 1MHz: Ensures high spectral purity and minimal dispersion, crucial for data integrity in high-speed communications.
•Reference Light Source for Scalable Designs
Tailored for integration with silicon photonics platforms and other advanced photonic systems, providing an excellent match for next-generation optical designs.
•Separate Product Selection for Sensing Applications
Specialized designs are available to address the unique requirements of sensing applications, offering precision and stability for optimal performance.
Denselight offers versatility and reliability, our DFB Lasers provide the foundation for cutting-edge solutions into communications, sensing, and photonic integration
•Excellent Linewidth < 1MHz: Ensures high spectral purity and minimal dispersion, crucial for data integrity in high-speed communications.
•Reference Light Source for Scalable Designs
Tailored for integration with silicon photonics platforms and other advanced photonic systems, providing an excellent match for next-generation optical designs.
•Separate Product Selection for Sensing Applications
Specialized designs are available to address the unique requirements of sensing applications, offering precision and stability for optimal performance.
Recommended Links
DFB - Grey Laser
DFB lasers are an ideal blend of simplicity, coherence, and reliability for many FSO systems — offering just enough spectral purity, modulation support, and ruggedness to handle short-to-mid-range free-space links. They enable:
1–10 Gbps systems
Eye-safe operation (especially 1550 nm)
Cost-effective coherent or direct-detection platforms
1–10 Gbps systems
Eye-safe operation (especially 1550 nm)
Cost-effective coherent or direct-detection platforms
Recommended Links
NLW-ECL
The significance of a 3 kHz linewidth for a coherent light source
•Denselight supplies the ENGINE – Gain Chip C Band, L Band, O Band.
•Enables the External Cavity Laser -Enables Coherent Detection Systems
•Lower Phase Noise
•Benchmark for Premium Coherent Sources<100 kHz: Good<10 kHz: High performance~3 kHz: Elite, near-external cavity class performance
A Highlighted key “Value Driver” for coherent sensing, Doppler, OCT, and metrology. Technically Paired Capability with (Low RIN, thermal stability, and packaging ruggedness)
•Denselight supplies the ENGINE – Gain Chip C Band, L Band, O Band.
•Enables the External Cavity Laser -Enables Coherent Detection Systems
•Lower Phase Noise
•Benchmark for Premium Coherent Sources<100 kHz: Good<10 kHz: High performance~3 kHz: Elite, near-external cavity class performance
A Highlighted key “Value Driver” for coherent sensing, Doppler, OCT, and metrology. Technically Paired Capability with (Low RIN, thermal stability, and packaging ruggedness)
Recommended Links
NLW-ECL - 3Khz
The significance of a 3 kHz linewidth for a coherent light source
•Denselight supplies the ENGINE – Gain Chip C Band, L Band, O Band.
•Enables the External Cavity Laser -Enables Coherent Detection Systems
•Lower Phase Noise
•Benchmark for Premium Coherent Sources<100 kHz: Good<10 kHz: High performance~3 kHz: Elite, near-external cavity class performance
A Highlighted key “Value Driver” for coherent sensing, Doppler, OCT, and metrology. Technically Paired Capability with (Low RIN, thermal stability, and packaging ruggedness)
•Denselight supplies the ENGINE – Gain Chip C Band, L Band, O Band.
•Enables the External Cavity Laser -Enables Coherent Detection Systems
•Lower Phase Noise
•Benchmark for Premium Coherent Sources<100 kHz: Good<10 kHz: High performance~3 kHz: Elite, near-external cavity class performance
A Highlighted key “Value Driver” for coherent sensing, Doppler, OCT, and metrology. Technically Paired Capability with (Low RIN, thermal stability, and packaging ruggedness)
Recommended Links
NLW-ECL - 10Khz
A 10 kHz linewidth laser represents a high-performance coherent light source — offering a compelling mix of practical stability, manufacturability, and cost-effectiveness for a broad set of advanced photonics applications.
Coherent Detection-Ready
Excellent for systems using heterodyne detection, including:FMCW LIDARCoherent receivers (e.g., in telecom)Precision metrology
✔ Beats typical telecom-grade DFBs (~1–5 MHz) by orders of magnitude.
They strike a balance between:
✅ Performance (coherence, stability, Doppler resolution)
✅ Manufacturability (compared to sub-kHz ECLs)
✅ Cost-effectiveness (vs. ultra-high-end or tunable platforms)
Coherent Detection-Ready
Excellent for systems using heterodyne detection, including:FMCW LIDARCoherent receivers (e.g., in telecom)Precision metrology
✔ Beats typical telecom-grade DFBs (~1–5 MHz) by orders of magnitude.
They strike a balance between:
✅ Performance (coherence, stability, Doppler resolution)
✅ Manufacturability (compared to sub-kHz ECLs)
✅ Cost-effectiveness (vs. ultra-high-end or tunable platforms)
Recommended Links
NLW-ECL - 50Khz
A 50 kHz linewidth laser represents a solid, mid-range coherent light source — offering significant performance for many sensing and communication applications
•Offers long coherence length, good phase stability,
•Suitable for many high-value applications
•Phase noise: Acceptably low for coherent detection, interferometry, and modulated light sources.
Sufficient for Many Coherent Applications
•Coherence length >1.5 km
•Medium-range FMCW LIDAR
•Free-space optical comms
•Distributed fiber sensors (DAS, BOTDA)OCT with short-to-medium depth
•Offers long coherence length, good phase stability,
•Suitable for many high-value applications
•Phase noise: Acceptably low for coherent detection, interferometry, and modulated light sources.
Sufficient for Many Coherent Applications
•Coherence length >1.5 km
•Medium-range FMCW LIDAR
•Free-space optical comms
•Distributed fiber sensors (DAS, BOTDA)OCT with short-to-medium depth
Recommended Links
NLW-ECL - 100Khz
A 100 kHz linewidth laser: A narrow-linewidth, coherent-capable source.
•Sufficient for a wide range of coherent photonic applications.
•Nearly 1 km coherence length, sufficient for most interferometric and coherent detection applications.
Excellent Entry Point for Coherent Systems
Opens access to:Coherent LIDAR
Short-range FMCWφ-OTDR
Fiber sensing
Free-space comms
Compared to Other Linewidth Classes
Linewidth Coherence Length Target Applications
<10 kHz >10 km High-end LIDAR, metrology, quantum sensing
100 kHz ~1 km Industrial LIDAR, OCT, FSO, sensing
1–5 MHz <100 m Telecom DFBs, short-range links, basic laser comms
•Sufficient for a wide range of coherent photonic applications.
•Nearly 1 km coherence length, sufficient for most interferometric and coherent detection applications.
Excellent Entry Point for Coherent Systems
Opens access to:Coherent LIDAR
Short-range FMCWφ-OTDR
Fiber sensing
Free-space comms
Compared to Other Linewidth Classes
Linewidth Coherence Length Target Applications
<10 kHz >10 km High-end LIDAR, metrology, quantum sensing
100 kHz ~1 km Industrial LIDAR, OCT, FSO, sensing
1–5 MHz <100 m Telecom DFBs, short-range links, basic laser comms
Recommended Links
NLW-ECL - 10/20 mW
Well Aligned power ranges 10 mW / 20 mW
Acceptable to the needs of most coherent sensing, FMCW LIDAR, OCT, interferometry, and optical integration platforms.
Power Range That Matches Core Use Cases
Maintains Linewidth and Spectral Purity
Application-Driven Flexibility
Offering 10/20 mW NLW laser options provides the right coherence and integration point for application class.
10 mW: Compact systems L ab or prototype use
On-chip or integrated optics
20 mW: Field-deployable Modulation-capable architectures
High dynamic range sensing
Acceptable to the needs of most coherent sensing, FMCW LIDAR, OCT, interferometry, and optical integration platforms.
Power Range That Matches Core Use Cases
Maintains Linewidth and Spectral Purity
Application-Driven Flexibility
Offering 10/20 mW NLW laser options provides the right coherence and integration point for application class.
10 mW: Compact systems L ab or prototype use
On-chip or integrated optics
20 mW: Field-deployable Modulation-capable architectures
High dynamic range sensing
Recommended Links
Fabry-Perot
A Fabry-Perot (FP) laser in the O-band (1260–1360 nm)
O-Band FP Lasers
•Passive optical networks (PONs): Short reach,
•High volume Data centers: 1310 nm FP used in 1G/10G transceivers
•Industrial sensors: Temperature or strain sensing modules
Fabry–Pérot (FP) lasers are among the most basic and widely used semiconductor lasers, known for their multi-longitudinal-mode operation and simplicity. Key role cost-sensitive, short-distance, or broadband optical systems
O-Band FP Lasers
•Passive optical networks (PONs): Short reach,
•High volume Data centers: 1310 nm FP used in 1G/10G transceivers
•Industrial sensors: Temperature or strain sensing modules
Fabry–Pérot (FP) lasers are among the most basic and widely used semiconductor lasers, known for their multi-longitudinal-mode operation and simplicity. Key role cost-sensitive, short-distance, or broadband optical systems
Recommended Links
FP - O Band
A Fabry-Perot (FP) laser in the O-band (1260–1360 nm)
O-Band FP Lasers
•Passive optical networks (PONs): Short reach,
•High volume Data centers: 1310 nm FP used in 1G/10G transceivers
•Industrial sensors: Temperature or strain sensing modules
Fabry–Pérot (FP) lasers are among the most basic and widely used semiconductor lasers, known for their multi-longitudinal-mode operation and simplicity. Key role cost-sensitive, short-distance, or broadband optical systems
O-Band FP Lasers
•Passive optical networks (PONs): Short reach,
•High volume Data centers: 1310 nm FP used in 1G/10G transceivers
•Industrial sensors: Temperature or strain sensing modules
Fabry–Pérot (FP) lasers are among the most basic and widely used semiconductor lasers, known for their multi-longitudinal-mode operation and simplicity. Key role cost-sensitive, short-distance, or broadband optical systems
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FP - C Band
A Fabry-Perot (FP) laser in the C-band (1530–1565 nm)
C-Band FP Lasers
•Pump sources (for SOAs or EDFAs)
•Broadband seed sources in tunable systems
•Low-cost source for FBG interrogators or spectroscopic probes
FP lasers in the C-band are suitable for applications like long-distance transmission, wavelength-division multiplexing (WDM), and metro networks.
They provide reliable performance, moderate power efficiency, and good signal integrity for high-speed data transmission in fiber optic systems.
C-Band FP Lasers
•Pump sources (for SOAs or EDFAs)
•Broadband seed sources in tunable systems
•Low-cost source for FBG interrogators or spectroscopic probes
FP lasers in the C-band are suitable for applications like long-distance transmission, wavelength-division multiplexing (WDM), and metro networks.
They provide reliable performance, moderate power efficiency, and good signal integrity for high-speed data transmission in fiber optic systems.
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FP - L Band
A Fabry-Perot (FP) laser in the L-band (1565–1625 nm)
L-Band FP Lasers
•Long-range sensing
•Extension bands for DWDM or Raman gain experiments
•Medical and scientific instrumentation
Used in optical communication systems, particularly for extending the reach and capacity of wavelength-division multiplexing (WDM) networks.
FP lasers in this range offer a cost-effective solution for medium to long-distance transmission. These lasers are ideal for high-speed data transmission in fiber optic networks, providing reliable signal integrity and moderate power efficiency.
L-Band FP Lasers
•Long-range sensing
•Extension bands for DWDM or Raman gain experiments
•Medical and scientific instrumentation
Used in optical communication systems, particularly for extending the reach and capacity of wavelength-division multiplexing (WDM) networks.
FP lasers in this range offer a cost-effective solution for medium to long-distance transmission. These lasers are ideal for high-speed data transmission in fiber optic networks, providing reliable signal integrity and moderate power efficiency.
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FP - 100 mW
100 mW / 200 mW output power in Fabry–Pérot (FP) lasers — In both CW (continuous-wave) and pulsed capabilities
Broadband Source for Amplifiers or ASEHigh-power FP lasers ideal seed sources for:
•SOAs (Semiconductor Optical Amplifiers)
•EDFA preamp stages
•Broadband ASE generation
Cost-Effective Power Scaling Compared to DFB or ECL lasers, high-power FP lasers:
Cost Effective to manufacture
Does not require complex grating structures
Can operate with simpler driver electronics
Broadband Source for Amplifiers or ASEHigh-power FP lasers ideal seed sources for:
•SOAs (Semiconductor Optical Amplifiers)
•EDFA preamp stages
•Broadband ASE generation
Cost-Effective Power Scaling Compared to DFB or ECL lasers, high-power FP lasers:
Cost Effective to manufacture
Does not require complex grating structures
Can operate with simpler driver electronics
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FP - 200 mW
A Fabry-Perot (FP) laser with 200 mW output power
Offer a versatile, cost-effective light source for a wide range of industrial sensing and optical system applications
Enables:
•Budget-friendly light engines
•Strong optical backscatter or signal response
•Pump sources for gain modules
•Short- to mid-range sensing (when linewidth is not a limiting factor)
Applications of High-Power FP Lasers
Power Mode Application
100 mW CW Pumping SOAs, broadband illumination, short-range sensing
100 mW Pulsed OTDR, TOF sensing, industrial LIDAR modules
200 mW CW High SNR FBG and DAS systems, interferometry
200 mW Pulsed Long-range reflectometry, scientific spectroscopy
Offer a versatile, cost-effective light source for a wide range of industrial sensing and optical system applications
Enables:
•Budget-friendly light engines
•Strong optical backscatter or signal response
•Pump sources for gain modules
•Short- to mid-range sensing (when linewidth is not a limiting factor)
Applications of High-Power FP Lasers
Power Mode Application
100 mW CW Pumping SOAs, broadband illumination, short-range sensing
100 mW Pulsed OTDR, TOF sensing, industrial LIDAR modules
200 mW CW High SNR FBG and DAS systems, interferometry
200 mW Pulsed Long-range reflectometry, scientific spectroscopy
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FP - Continuous Wave
A Fabry-Perot (FP) laser operating in Continuous Wave (CW)
CW mode significantly enhances usability across a broader range of industrial, sensing, and optical instrumentation applications.
FP-CW lasers offer moderate output power and a broader linewidth compared to DFB lasers, making them suitable for short- to medium-range transmission and cost-effective solutions in various photonic systems.
CW mode significantly enhances usability across a broader range of industrial, sensing, and optical instrumentation applications.
FP-CW lasers offer moderate output power and a broader linewidth compared to DFB lasers, making them suitable for short- to medium-range transmission and cost-effective solutions in various photonic systems.
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FP - Pulsed
A Fabry-Perot (FP) laser operating in pulsed mode, offers Versatility Across Optical Modes.
While CW Mode: Continuous light for sensing, interferometry, metrology applications
Pulsed Mode: Used for time-domain reflectometry, LIDAR, spectroscopy.. Pulsed capability adds:
•Time-resolution
•Ranging possibilities.
While CW Mode: Continuous light for sensing, interferometry, metrology applications
Pulsed Mode: Used for time-domain reflectometry, LIDAR, spectroscopy.. Pulsed capability adds:
•Time-resolution
•Ranging possibilities.
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FP - Grey Laser
DFB lasers are an ideal blend of simplicity, coherence, and reliability for many FSO systems — offering just enough spectral purity, modulation support, and ruggedness to handle short-to-mid-range free-space links. They enable:
1–10 Gbps systems
Eye-safe operation (especially 1550 nm)
Cost-effective coherent or direct-detection platforms
1–10 Gbps systems
Eye-safe operation (especially 1550 nm)
Cost-effective coherent or direct-detection platforms
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Development
A New Era in Photonic Packaging: Introducing HybridXwave for Next-Gen SOA and LDOP Solutions
Assembly and Optical Efficiency: Setting a New Standard
•HybridXwave integrates photonic and electronic components into a single, compact system that prioritizes optical efficiency.
•By carefully aligning waveguides, amplifiers, and optical sources using the concept of Optical Circuit Building (OCB),
•The platform minimizes signal loss and optimizes light flow.
•A 3D architecture enables high-density configurations that are essential for space-constrained Plug in points, such as Environments like data centers and telecom networks Spacing, Sensing enclosures.
Assembly and Optical Efficiency: Setting a New Standard
•HybridXwave integrates photonic and electronic components into a single, compact system that prioritizes optical efficiency.
•By carefully aligning waveguides, amplifiers, and optical sources using the concept of Optical Circuit Building (OCB),
•The platform minimizes signal loss and optimizes light flow.
•A 3D architecture enables high-density configurations that are essential for space-constrained Plug in points, such as Environments like data centers and telecom networks Spacing, Sensing enclosures.
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Development - HybridXWave
A New Era in Photonic Packaging: Introducing HybridXwave for Next-Gen SOA and LDOP Solutions
Assembly and Optical Efficiency: Setting a New Standard
•HybridXwave integrates photonic and electronic components into a single, compact system that prioritizes optical efficiency.
•By carefully aligning waveguides, amplifiers, and optical sources using the concept of Optical Circuit Building (OCB),
•The platform minimizes signal loss and optimizes light flow.
•A 3D architecture enables high-density configurations that are essential for space-constrained Plug in points, such as Environments like data centers and telecom networks Spacing, Sensing enclosures.
Assembly and Optical Efficiency: Setting a New Standard
•HybridXwave integrates photonic and electronic components into a single, compact system that prioritizes optical efficiency.
•By carefully aligning waveguides, amplifiers, and optical sources using the concept of Optical Circuit Building (OCB),
•The platform minimizes signal loss and optimizes light flow.
•A 3D architecture enables high-density configurations that are essential for space-constrained Plug in points, such as Environments like data centers and telecom networks Spacing, Sensing enclosures.
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Development - HOSA
HOSA (Hybrid Optical Sub Assembly)
•Enhanced Performance and Reliability
•HybridXwave harnesses the power of native hybrid packaging to combine photonic and electronic components into a unified, highly efficient system.
•Minimizing optical losses, parasitic effects, and improving thermal management, this packaging ensures superior performance in high-speed, high-capacity optical networks.
•The Low DOP L-Band SOA/ C Band – Super C Band ASE Source integrated within this hybrid system, provides stable amplification, lower noise, and enhanced signal quality—key for demanding Sensing and telecom applications
•Enhanced Performance and Reliability
•HybridXwave harnesses the power of native hybrid packaging to combine photonic and electronic components into a unified, highly efficient system.
•Minimizing optical losses, parasitic effects, and improving thermal management, this packaging ensures superior performance in high-speed, high-capacity optical networks.
•The Low DOP L-Band SOA/ C Band – Super C Band ASE Source integrated within this hybrid system, provides stable amplification, lower noise, and enhanced signal quality—key for demanding Sensing and telecom applications
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Development - Hybrid Manufacturing
Hybrid Manufacturing is the catayst of the HybridXWave and its strategic role in the photonics industry is key to establishing its value as a next-generation packaging and integration approach.
Hybrid Manufacturing, as applied to HybridXWave,
•Refers to the integration of dissimilar photonic components — such as lasers, gain chips, modulators, filters, lenses, fibers, and electrical interconnects — into a single, compact, and application-specific photonic package
•Using combinations of precision assembly techniques:
•This includes:Flip-chip die bonding (active & passive alignment)Wire bonding and die attach (thermal + electrical interface)
•Fiber attach and coupling (PM or SM)Micro-optical alignment (for beam shaping, collimation)Thermal and RF integration (TEC, drivers, and shielding)Hybrid submounts (Silicon, InP, glass, ceramics
•A Complimentary or Co-packaged) Approach.
•The HybridXWave is a modular photonic engine Approach that brings best-of-breed components together in a single interoperable form factor — without needing to redesign a full monolithic PIC.
Hybrid Manufacturing, as applied to HybridXWave,
•Refers to the integration of dissimilar photonic components — such as lasers, gain chips, modulators, filters, lenses, fibers, and electrical interconnects — into a single, compact, and application-specific photonic package
•Using combinations of precision assembly techniques:
•This includes:Flip-chip die bonding (active & passive alignment)Wire bonding and die attach (thermal + electrical interface)
•Fiber attach and coupling (PM or SM)Micro-optical alignment (for beam shaping, collimation)Thermal and RF integration (TEC, drivers, and shielding)Hybrid submounts (Silicon, InP, glass, ceramics
•A Complimentary or Co-packaged) Approach.
•The HybridXWave is a modular photonic engine Approach that brings best-of-breed components together in a single interoperable form factor — without needing to redesign a full monolithic PIC.
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Development - DPhi®
DPhi® enabling integration to increase port densities.
Silicon photonics is a technology that integrates optical
components, such as lasers, modulators, detectors, and
waveguides, directly onto a silicon-based integrated circuit.
This integration of photonics with traditional silicon electronics
allows for the manipulation of optical signals on the same chip,
providing several advantages
in terms of performance, power efficiency, and integration capabilities. Silicon photonics can contribute to increased port densities and enable the use of multiple wavelengths, among other benefits.
Silicon photonics is a technology that integrates optical
components, such as lasers, modulators, detectors, and
waveguides, directly onto a silicon-based integrated circuit.
This integration of photonics with traditional silicon electronics
allows for the manipulation of optical signals on the same chip,
providing several advantages
in terms of performance, power efficiency, and integration capabilities. Silicon photonics can contribute to increased port densities and enable the use of multiple wavelengths, among other benefits.
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Development - SiP
Why It Matters for the Future Photonics is moving fast — and innovation is often limited by packaging, not by the chip.
Silicon Can’t Do Everything
Silicon photonics is excellent for passive optics (waveguides, splitters, modulators), but It doesn’t lase
Silicon has an indirect bandgap (no efficient light generation)Gain, amplification,
Detection require InP, GaAs, or Ge materials High-power or narrow-linewidth lasers must come from off-chip sources
The HybridXWave approach to hybrid manufacturing fills a critical industry gap:
✔ Enables tailored packaging for specific optical architectures
✔ Bridges discrete and integrated photonics worlds
✔ Allows next-gen LIDAR, medical imaging, and quantum optics to scale
✔ Offers flexibility without compromising performance
Silicon Can’t Do Everything
Silicon photonics is excellent for passive optics (waveguides, splitters, modulators), but It doesn’t lase
Silicon has an indirect bandgap (no efficient light generation)Gain, amplification,
Detection require InP, GaAs, or Ge materials High-power or narrow-linewidth lasers must come from off-chip sources
The HybridXWave approach to hybrid manufacturing fills a critical industry gap:
✔ Enables tailored packaging for specific optical architectures
✔ Bridges discrete and integrated photonics worlds
✔ Allows next-gen LIDAR, medical imaging, and quantum optics to scale
✔ Offers flexibility without compromising performance